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LG G1500 Manual

LG G1500 Manual

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REVISED HISTORY
DATE
ISSUE
CONTENTS OF CHANGES
S/W VERSION
Initial Release
The information in this manual is subject to change without notice and should not be construed as
a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make
changes to equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the
G1500.
-1-

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Summary of Contents for LG G1500

  • Page 1 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the G1500.

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION........…5 4. TROUBLESHOOTING ....… 52 1.1 Purpose ..........…. 4.1 RF Components ......…. 1.2 Regulatory Information ......4.2 Rx Trouble .......... 1.3 Abbreviations ......... 4.3 Tx Trouble .......... 4.4 Power On Trouble ......…. 4.5 Charging Trouble ......…. 2.
  • Page 3 8. CIRCUIT DIAGRAM ......107 8.1 Main Chipset ………………….....….. 8.2 Memory & MMI ……………..………. 8.3 MIDI ………………………………..…. 8.4 RF Circuit ……........….. 9. PCB LAYOUT ........111 10. STAND ALONE TEST ....113 10.1 What’s the Standalone Test? ..…… 10.2 Standalone Test Equipment Setup… 10.3 H/W Test ……......……...

  • Page 4: Introduction

    E. Notice of Radiated Emissions The LG-G1500 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
  • Page 5 The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation The LG-G1500 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

  • Page 6: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Rate CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrostatic Discharge FPCB Flexible Printed Circuit Board...
  • Page 7 1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...

  • Page 8: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Support Dual band (EGSM/DCS) Bar Type GPRS Size 105.2 × 45.6 × 21.3 mm (Max) Weight 80g (Standard battery) Battery 3.7V > 850mAh Li-Ion (Standard) Talk Time (PL : 7) 3hours (Min) at 850mAh (Standard) Standby Time (PL : 9) 200hours (Min) at 850mAh (Standard)

  • Page 9: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification TX: 890 + n × 0.2 MHz RX: 935 + n × 0.2 MHz (n=1~124) EGSM Frequency Band TX: 890 + (n-1024) × 0.2 MHz RX: 935 + (n-1024) × 0.2 MHz (n=975~1024) TX: 1710 + (n-512) ×...
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 Output RF Spectrum (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 11 2. PERFORMANCE Item Description Specification Offset from Carrier (kHz). Max. dBm Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio BER (Class II) < 2.439% @-100 dBm RX Level Report Accuracy ±3 dB 8±3 dB...
  • Page 12 2. PERFORMANCE Item Description Specification Frequency (Hz) Max.(dB) Min.(dB) 1,000 Receiving Response 3,000 3,400 4,000 * Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. STMR 13±5 dB Stability Margin >...
  • Page 13 2. PERFORMANCE Item Description Specification GSM/Level 7 (Battery Capacity 850mA): Up to 180 Min Talk Time GSM/Level 12 (Battery Capacity 850mA): Up to 300 Min Under conditions, Up to 200hours: 1. Brand new and full 850mAh battery 2. Full charge, no receive/send and keep GSM in idle Standby Time mode.
  • Page 14 2. PERFORMANCE Item Description Specification Switching-mode charger Travel Charger Input: 100 ~ 240 V, 60 Hz Output: 5.2 V, 800 mA - 15 -...

  • Page 15: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a VCTCXO part. And the main RF Chipset CX74017[U441]is a single-chip dual-band transceiver for the extended global system for mobile communication[E-GSM900MHz]/ Digital communication system[DCS1800MHz] voice and data transfer applications.
  • Page 16 3. TECHNICAL BRIEF A. RF Front End RF front end consists of Antenna Switch(FL407), dual band LNAs integrated in transceiver(U441). The Received RF signals (GSM 925MHz ∼ 960MHz, DCS 1805MHz ∼ 1880MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch. The Antenna Switch (FL407) is used to control the Rx and TX paths.
  • Page 17 3. TECHNICAL BRIEF C. DC offset compensation Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the baseband chain at any point. After compensation, the correction voltages are held on capacitors for the duration of the receive slot(s).

  • Page 18: Transmitter Part

    3. TECHNICAL BRIEF 3.3 Transmitter Part The Transmitter part contains CX74017 active parts, PAM and Antenna Switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop block(OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO which can operate at either final RF output frequency.
  • Page 19 3. TECHNICAL BRIEF B. OPLL The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating signal. The IF signal goes via external passive bandpass filter to one port of the phase detector. The other side of the phase detector input is LO signal.
  • Page 20 3. TECHNICAL BRIEF The counter and mode settings of the synthesizer are also programmed via 3-wire interface. CX74017 2V7_VTCXO 13MHz vco = (N+3.5+FN/2^22) ref/R 13MHz Fractional-N REFCLK Base Band Block Figure 3-3. Synthesizer Block diagram. D. Power Amplifier Module The RF3110B[U416] is a Dual band amplifier for E-GSM(880 to 915MHz) and DCS1800(1710 to 1785MHz).

  • Page 21: 13Mhz Clock

    3. TECHNICAL BRIEF 3.4 13 MHz Clock The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the CX74017 RF Main Chip, BB Analog chip-set (AD6521), and Digital (AD6522). FREF Figure 3-4.

  • Page 22: Testing Set-Up And Checking Signals

    3. TECHNICAL BRIEF 3.6 Testing Set-up and Checking Signals A. Received RF Level and Checks This section shows the typical RF power levels expected throughout the receiver path. A block diagram shows the locations of the RF measurement points and levels as shown in Fig. 3-11. Receiver Testing Set-up To check the receiver the following conditions have to be set: On a signal generator or a GSM/DCS test box, output amplitude of CW sugnal = -60 dBm at either:...
  • Page 23 3. TECHNICAL BRIEF Testing Transmitter Using a suitable high frequency probe measure the RF levels at the relevant points shown in Fig. 3-9, 10. and compare your measurements with those shown in the diagram. If there are any major difference between the readings taken and those indicated then further investigation of that particular point will be required.
  • Page 24 3. TECHNICAL BRIEF RF components (Component Side) CN303 FL407 FL406 U441 U416 U414 X401 U413 Figure 3-6. RF components (Component Side). Reference Description Reference Description U441 RF Main Chipset FL406 Dual SAW Filter CN303 Mobile S/W X401 VCTCXO FL407 Ant. S/W U414 U416 U413...
  • Page 25 3. TECHNICAL BRIEF Test point of Rx Levels ① ② ③ ④ Figure 3-7. Test point of Rx Power Levels. - 26 -...
  • Page 26 3. TECHNICAL BRIEF Test point of Tx Power Levels ⑤ ⑥ ⑨ ⑩ ⑦ ⑧ Figure 3-8. Test point of Tx Power Levels. - 27 -...
  • Page 27 3. TECHNICAL BRIEF Test point of Tx Power Levels C444 C448 TXRAMP (R401) TXPA (R404) RF2.85V 2V7_VCTCXO 13MHz Clock TXQN TXIN RXIN RXQN TXQP TXIP RXIP RXQP Figure 3-9. Control signal test points - 28 -...
  • Page 28 3. TECHNICAL BRIEF Control signal test points TP402(LE) TP404(Clock) TP406(Data) TP403(RXEN) Figure 3-10. Control signal test points - 29 -...
  • Page 29 3. TECHNICAL BRIEF Figure 3-9. Transmitter & Receiver RF Levels - 30 -...
  • Page 30 3. TECHNICAL BRIEF Figure 3-12. Regulator Output (RF2V8) Figure 3-13. VCTCXO Power Supply (2V7_VTCXO). - 31 -...
  • Page 31 3. TECHNICAL BRIEF Figure 3-14. 13MHz Clock. Figure 3-15. Control Signal (VC1,VC2) in Rx mode (GSM, DCS both). - 32 -...
  • Page 32 3. TECHNICAL BRIEF Figure 3-16. Control Signal of FEM in GSM TX mode Figure 3-17. Control Signal of FEM in DCS TX mode. - 33 -...
  • Page 33 3. TECHNICAL BRIEF Figure 3-18. LE, Clock, Data TXEN TXRAMP TXPA Figure 3-19. TXEN, TXRAMP, TXPA. - 34 -...
  • Page 34 3. TECHNICAL BRIEF Figure 3-20. TX IQ Signal Figure 3-21. RX IQ Signal - 35 -...

  • Page 35: Digital Main Processor

    3. TECHNICAL BRIEF 3.7 Digital Main Processor The AD6522 is an ADI designed processor. AD6522 AD6521 Subsystem (VBC) DSP BUS EBUS PBUS DMA and BUS ARBITRATION SBUS Peripheral SRAM FLASH Subsystem Subsystem (ARM7TDMI) RF-Control Figure 3-22. Top level block diagram of the AD6522 internal architecture. BUS Arbitration Subsystem •...
  • Page 36 3. TECHNICAL BRIEF MCU subsystem • It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access control module. • The maximum clock frequency for the ARM7TDMI is 39MHz at 2.45V. • The main clock is 13MHz and it is provided by VCTCXO. The Clock & BS(Bus Select) generator make internal clock by multiplying the main clock by 1X, 1.5X, 2X and 3X.
  • Page 37 3. TECHNICAL BRIEF AD6522 GSM-PROCESSOR KEYPAD KEYPADCOL[4:0] JTAGEN Matrix JTAG KEYPADROW[4:0] TCK.TMS TDI.TDO BACKLIGHT0 JTAGE.HSL.GPIO Backlight Universal Service light BACKLIGHT1 USCTX/RX/CLK System Generic Serial port A Connector Generic Serial port B (USC) ROMCS Generic Serial port D FLASH ADD[23:0] 16bit DATA[15:0] PWRON Power...
  • Page 38 3. TECHNICAL BRIEF Interconnection with external devices RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz. LCD module interface Controlled by _LCD_MAIN_CS, LCD_RES, LCD_RS, _WR, _RD , DATA [00...07] ports. Table 3-3. Description LCD_MAIN_CS LCD chip enable. Each LCD has CS pin LCD_RES This pin resets LCD module.
  • Page 39 3. TECHNICAL BRIEF SIM interface The AD6522 check status periodically in call mode if SIM card is inserted or not, but the AD6522 don't check in deep sleep mode. Interface by SIMDATAOP, SIMCLK, SIM_RST(GPIO_23) Table 3-5. Description This pin receives and sends data to SIM card. This model supports only SIMDATAOP 3.0 volt interface SIM card.

  • Page 40: Analog Main Processor

    3. TECHNICAL BRIEF 3.8 Analog Main Processor AD6521 AD6521 Dual-Mode Voiceband Baseband Codec MCLK JTAG Interface MCLKEN RESET for ICO ITXP I TRANSMIT INTERP FILTER ITXN BSDI QTXP Q TRANSMIT FILTER QTXN BSIFS GMSK MOD BSAEBAND 32 x 10 bit TXON 10 bit SERIAL...
  • Page 41 3. TECHNICAL BRIEF BB Transmit section This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in accordance with GSM 05.05 Phase 2 specifications. • The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter.
  • Page 42 3. TECHNICAL BRIEF Figure 3-26. AD6521 Circuit diagram - 43 -...

  • Page 43: Power Management

    3. TECHNICAL BRIEF 3.9 Power Management ADP3408 Figure 3-28. ADP3408 inner block diagram Power up sequence logic The ADP3408 controls power on sequence. Power on sequence If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. REFOUT is also enabled, Reset is generated and send to the AD6522.
  • Page 44 3. TECHNICAL BRIEF LDO block There are 6LDOs in the ADP3408 Table 3-6. Description VSIM 2.86V (is provided to SIM card) VCORE 2.45V (is provided to the AD6522 & AD6521’s digital core) VRTC 2.45V (is provided to the RTC and Backup Battery) 2.45V (is provided to the AD6521 I/O and used as microphone bias) VTCXO 2.715V (is provided to VCTCXO)

  • Page 45: Memories

    3. TECHNICAL BRIEF 3.10 Memories • 32M flash memory + 8M SRAM • 16 bit parallel data bus • ADD01 ~ ADD21. • RF Calibration data are stored in Flash 3.11 Display and Interface Table 3-7. Display Format 128 x 64 dots Back light LED Backlight The phone has single type LCD.

  • Page 46: Microphone

    3. TECHNICAL BRIEF Figure 3-29. Keypad Switches and Scanning. 3.13 Microphone The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to VINNORP (#J10) and VINNORN (#K10) pins of AD6522. The voltage supply 2V45_VAN is output from ADP3408, and is a bias voltage for both the VINNORP (through R101) and VINAUX (through R112) lines.
  • Page 47 3. TECHNICAL BRIEF Figure 3-30. Microphone - 48 -...

  • Page 48: Earpiece

    3. TECHNICAL BRIEF 3.14 Earpiece The earpiece is driven directly from AD6521 VOUTNORP (#K8) and VOUTNORN (#K7) pins and the gain is controlled by the PGA in an AD6521. The earpiece is placed in the front cover and contacted to main PCB. Figure 3-31.

  • Page 49: Lcd Back-Light Illumination

    3. TECHNICAL BRIEF 3.17 LCD Back-light Illumination In LCD Back-light illumination, there is an driver in FPCB Board, which is driven by BACKLIGHT line from AD6522. Figure 3-33. LCD back-light Illumination. - 50 -...

  • Page 50: Speaker & Midi Ic

    Its sounds more smoothly comparing to other buzzer sound because of using audio AMP and speaker. LG-G1500 also uses step-up ring sound mechanism. When ring volume is set to maxim and a incoming call is occurred, it rings from low to high gradually.

  • Page 51: Troubleshooting

    4. TROUBLESHOOTING 4. TROUBLESHOOTING 4.1 RF Components CN303 FL407 FL406 U441 U416 U414 X401 U413 RF Components Reference Description Reference Description U441 RF Main Chipset FL406 Dual SAW Filter CN303 Mobile S/W X401 VCTCXO FL407 Ant. S/W U414 U413 Inverter IC U416 - 52 -...

  • Page 52: Rx Trouble

    4. TROUBLESHOOTING 4.2 RX Trouble START HP8922 : Test mode ⑥ 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting ⑤ Oscilloscope setting ① Check Regulator Circuit ① ② ② Check VCTCXO Circuit ④ ③ Check Control Signal ④...
  • Page 53 4. TROUBLESHOOTING 4.2.1 Checking Regulator Circuit U414.1 U414.6 Check Pin 6 Pin 6 High? Change the board Check Pin 1. RF 2.85V OK? Regulator Circuit is OK Replace U414 See next page to check VCTCXO - 54 -...
  • Page 54 4. TROUBLESHOOTING 4.2.2 Checking VCTCXO Circuit X401.4 X401.3 VCTCXO Circuit is OK Check Pin 3 See next page to check 13MHz OK? Refer to Graph 4-1 ANT SW & Mobile SW Check Pin 4 Change X401 2.7V OK? Refer to Graph 4-2 Check U101,PMIC Graph 4-1.
  • Page 55 4. TROUBLESHOOTING 4.2.3 Checking PLL Control Signal Data Clock Graph 4-3. RF Control Signal TP402(LE) Download the S/W Level is High? Check TP 403 TP404(Clock) Check TP406, 404 402. Check if there is TP406(Data) Any major Differencr Download the S/W Similar? Refer to Graph 4-3 major difference...
  • Page 56 4. TROUBLESHOOTING 4.2.4 Checking Ant SW & Mobile SW CN303 PIN2 FL407 CN303 PIN1 C453 C448 L410 L409 For these 2 test case, No Call connection is needed Check CN303 Pin 1,2 Open Changing CN303 with RF Cable connected. Short Changing CN303 Check CN303 Pin 1,2 with No RF Cable Connected...
  • Page 57 4. TROUBLESHOOTING Graph 4-4. ANT SW Control GSM, DCS RX Mode RXEN DCSSEL High GSMSEL TXPA Graph 4-5. Dual AND Gate input For GSM RX Mode RXEN ANT SW GSMSEL DCSSEL TXPA DCSSEL High EGSM TX DCS TX GSMSEL EGSM RX TXPA DCS RX Table 4-1.
  • Page 58 4. TROUBLESHOOTING 4.2.5 Checking SAW Filter Circuit FL406.1 FL406.3 FL406.7 FL406.5 Check RF Level of Changing Saw Filter Input Pin1: ~ -61dBm L409 for GSM For GSM : FL406.1 Pin3: ~ -61dBm L410 for DCS For DCS : FL406.3 Check the parts are well Soldered Check RF Level of For GSM : L409...
  • Page 59 4. TROUBLESHOOTING 4.2.6 Checking RX IQ RXIN RXQN RXIP RXQP Graph 4-7. RX IQ Signal Graph 4-8. RX I Signal (Extended) Check C401, 405. Check if there is Similar? Replace U441 Any Major Difference ♦Refer to Graph 4-7 Check C401 or C405. Check if there is Replace U441 Similar?

  • Page 60: Tx Trouble

    4. TROUBLESHOOTING 4.3 TX Trouble START ⑥ HP8922 : Test mode 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) ⑤ Spectrum analyzer setting Oscilloscope setting ① Check ① Regulator Circuit ② ④ ② Check VCTCXO Circuit ③ Check Control Signal ④...
  • Page 61 4. TROUBLESHOOTING 4-3-1 Checking Regulator Circuit • If you already check this point while checking RX part, you can skip this test. U414.1 U414.6 U414.2 Check Pin 6. Changing the Board Check Pin 1. RF 2.85V O.K? Pin 6. High ? Regulator Circuit is OK Replace U414 See next Page to check...
  • Page 62 4. TROUBLESHOOTING 4-3-2 Checking VCTCXO Circuit • If you already check this point while checking RX part, you can skip this test. X401.4 X401.3 VCTCXO Circuit is OK Check Pin 3. 13 MHz O.K? See next Page to check ♦Refer to Graph 4-9 ANT SW &...
  • Page 63 4. TROUBLESHOOTING 4-3-3 Checking Control Signal Data Clock Graph 4-11. RF Control Signal TXEN TXRAMP TXPA Graph 4-12. RF Control Signal (TX_EN, TX_RAMP, TX_PA) Check TP406,404,402 . Check if there is Download the S/W Similar? Any Major Difference ♦Refer to Graph 4-11 Check TP 405, R401, R404.
  • Page 64 4. TROUBLESHOOTING 4-3-4 Checking TX IQ RXIN RXQN RXIP RXQP Graph 4-13. TX IQ Signal Check C449, 454. Check if there is Similar? Download the S/W Any Major Difference ♦Refer to Graph 4-13 TX IQ Signal is OK See next Page to check RF TX Level - 65 -...
  • Page 65 4. TROUBLESHOOTING 4-3-5 Checking RF TX Level R407 L405 L403 R401 L401 R403 U416 U441 R404 R405 L413 R415 Check L401(For GSM), L403(For DCS) GSM: ~10dBm Changing U441 To Check TXVCO DCS : ~8dBm Output Soldering check Check R407(For GSM), R407, R410, R409, R415(For DCS) GSM: ~8dBm...
  • Page 66 4. TROUBLESHOOTING 4-3-6 Checking Ant SW & Mobile SW C461 CN303 PIN2 FL407 CN303 PIN1 FL407.3 FL407.5 C453 C448 Check C448, C453 Check whether Ant SW Check VC1, VC2 Changing board Set as TX mode ♦Refer to Graph 4-10,11 ♦Refer to Table 4-2 Check C448, C453 is Set for TX Mode ♦Refer to Table 4-2...
  • Page 67 4. TROUBLESHOOTING High High Graph 4-14. ANT SW Control Graph 4-15. ANT SW Control DCS TX Mode GSM TX Mode TXEN TXEN DCSSEL High DCSSEL GSMSEL High GSMSEL TXPA High TXPA High Graph 4-16. Dual AND Gate input Graph 4-17. Dual AND Gate input For DCS TX Mode For GSM TX Mode ANT SW...
  • Page 68 4. TROUBLESHOOTING 4-3-7 Receiver and Transmitter RF Level - 69 -...
  • Page 69 4. TROUBLESHOOTING 4-3-8 Receiver RF Level ② ④ ① ③ Figure 4-1. Test Points of Rx Level. - 70 -...
  • Page 70 4. TROUBLESHOOTING 4-3-9 Transmitter RF Level ⑤ ⑨ ⑥ ⑦ ⑩ ⑧ Figure 4-2. Test Points of Tx Level. - 71 -...
  • Page 71 4. TROUBLESHOOTING 4-3-10 Test Points for RF Components C444 C448 TXRAMP (R401) TXPA (R404) RF2.85V 2V7_VCTCXO 13MHz Clock TXQN TXIN RXIN RXQN TXQP TXIP RXIP RXQP Figure 4-3. Test Points for RF components - 72 -...
  • Page 72 4. TROUBLESHOOTING TP402(LE) TP404(Clock) TP406(Data) TP403(RXEN) Figure 4-4. Test Points for RF Components (Keypad Side/Lower) - 73 -...

  • Page 73: Power On Trouble

    4. TROUBLESHOOTING 4.4 Power On Trouble SETTING : Connect PIF, and set remote switch off at PIF. START Check Battery Voltage Charge or Change Battery > 3.35V ? Push power-on key Check the contact of power-key and check the level change or dome switch.
  • Page 74 4. TROUBLESHOOTING Test) U101 (PMIC) Check!! POWER-ON KEY signal input These powers should be necessary to power on. This signal should go HIGH when the power-on procedure is completed. Pin 22 (2V45_VCORE) Pin 25 (2V7_VTCXO) Pin 21 (2V8_VMEM) PMIC(U101) Pin 6 (2V45_VRTC) Pin 2 (POWERKEY) Pin 1 (RPWRON) - 75 -...

  • Page 75: Charging Trouble

    4. TROUBLESHOOTING 4.5 Charging Trouble SETTING : Connect the battery and the charging adaptor (TA). START Charging Connector Resolder CN302. (CN302) well-soldered? The charging adaptor(TA) is out of order. Voltage at Pin 10 of U101 Change the charging adaptor. = 5.2V? R104, Q102, D101 well- Resolder R104, Q102, D101 .
  • Page 76 4. TROUBLESHOOTING Test) Q301 & D302 Check!! The charging current will flow into this direction. R104 Q102 D101 - 77 -...

  • Page 77: Lcd Trouble

    4. TROUBLESHOOTING 4.6 LCD Trouble START PIF Power On Is the Reassemble LCD module connection of LCD module with with LCD connector LCD connector on PCB OK? Check the soldering Resolder CN304 of CN304 Change the FPCB and try again Does LCD work properly? Replace LCD module LCD working!
  • Page 78 4. TROUBLESHOOTING A) Check the connection between LCD & Main board B) Check the soldering of LCD & Main board C) Replace LCD module - 79 -...

  • Page 79: Receiver Trouble

    4. TROUBLESHOOTING 4.7 Receiver Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode START (PIF Power On. Test after Call 112) Check the signal level of Replace the Main board. “VOUTNORP” at R311. Is it a few ABB is out of order.
  • Page 80 4. TROUBLESHOOTING • The Receiver part Circuit Diagram - 81 -...

  • Page 81: Speaker Trouble

    4. TROUBLESHOOTING 4.8 Speaker Trouble SETTING : Connect PIF to the phone, and Power on. Enter The engineering mode, and set “Melody on” at Buzzer of BB test menu. START Speaker enable signal Voltage at Replace the main board Pin 1 of U330=2.8V? DBB is out of order Replace the main board Signal on C318 is PWM?
  • Page 82 4. TROUBLESHOOTING • Test) Speaker Check!! - 83 -...

  • Page 83: Mic. Trouble

    4. TROUBLESHOOTING 4.9 Mic. Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode. START MIC Bias (PIF Power On. Test after Call 112) voltage Check if the Voltage at pin 24 of Replace the C115 voltage is almost U101 is 2.45V(DC)? U101.
  • Page 84 4. TROUBLESHOOTING R101 C115 R103 MIC1 R105, R106, C120, C126 L101,L102 The signal flow of the microphone to MIC activating signal : Mic is U103. activated when this signal The voltage at this point goes to high. goes to almost 0V when the mic is activated.
  • Page 85 4. TROUBLESHOOTING Q101 R103 L102 C114 L101 R101 C126 R106 R105 C120 - 86 -...

  • Page 86: Vibrator Trouble

    4. TROUBLESHOOTING 4.10 Vibrator Trouble SETTING : Connect PIF to the phone, and Power on. Enter The engineering mode(2945#*#), and set 'Vibrator on' at Vibration of BB test menu. START Check the voltage through Q201 Is the voltage at pin 3 Check the soldering Resolder R252 of Q203 near 0 V?
  • Page 87 4. TROUBLESHOOTING Q203 R250 D202 When the vibrator works, the signal at this point goes to 2.8V When the vibrator works, the current flow this direction. When the vibrator works, the signal at this point goes to 0V - 88 -...

  • Page 88: Backlight Led Trouble

    4. TROUBLESHOOTING 4.11 Backlight LED Trouble SETTING : Connect PIF to the phone, and power on. Enter engineering mode, and set “Backlight on” in “at” “BB test-Backlight” menu START Is the voltage Check the soldering of level at Pin1 at O201 about R249,R251 1.2V?
  • Page 89 4. TROUBLESHOOTING • Test) D302~D313/Diode & Q201 Check!! R251 Q201 R249 A) Check the diode LD212~LD217. B) Check the current through Q201. - 90 -...

  • Page 90: Sim Detect Trouble

    4. TROUBLESHOOTING 4.12 SIM Detect Trouble SETTING : Insert the SIM into J304. Connect PIF to the phone, and power on. START Change the SIM. Our phone supports 3V SIM only. Does the SIM supports Voltage at pin 1 of Voltage at pin 19 of Replace U101.
  • Page 91 4. TROUBLESHOOTING • Test) SIM Connector Check!! J301 - 92 -...

  • Page 92: Earphone Trouble

    4. TROUBLESHOOTING 4.13 Earphone Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode. START (PIF Power On. Test after Call 112) Insert the earphone to the phone Earphone detect problem Does the audio profile of the ① phone change to the earphone mode? Audio path problem...
  • Page 93 4. TROUBLESHOOTING ① Earphone detect problem Check if between pin 3 and pin 4 of Voltage at R307 = 0V ? Change the J305. J305 is open ? Resolder R307 ④ R307 R306 J305 - 94 -...
  • Page 94 4. TROUBLESHOOTING Mic bias and path for the ear-mic This part makes the mic bias of the ear-mic. The direction of the audio Signal from the ear-mic. - 95 -...
  • Page 95 4. TROUBLESHOOTING Ear-mic detection part The reference voltage for the hook-detect of ear-mic. These resistors make the reference voltage. The voltage input of ear-mic detect. The voltage input of ear-mic hook-detect. Headset Jack The circuit diagram of the ear-mic jack - 96 -...

  • Page 96: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION 5.1 Disassembly 1. Remove the Battery and Screws as shown below. Figure 5-1. Removing the Battery. 2. Lift up and remove the Rear cover. Figure 5-2. Removing the Rear cover. - 97 -...
  • Page 97 5. DISASSEMBLY INSTRUCTION 3. Detach the rest components as shown below. Figure 5-3. Detaching the rest components. - 98 -...
  • Page 98 5. DISASSEMBLY INSTRUCTION 4. First, lift up PCB and remove the Antenna holding the hooks of the both end sides. After that, detach the Receiver and Keypad. Figure 5-4. Removing PCB, Antenna, Receiver and Keypad. 5. Use a tweezers to remove the Battery locker and Spring. Figure 5-5.

  • Page 99: Download And Calibration

    6. DOWNLOAD AND CALIBRATION 6. DOWNLOAD AND CALIBRATION 6.1 Download Figure 6-1 illustrate a download set-up Data Cable Figure 6-1. Download Setup 1. Download procedure Access flash loader program in PC. Select source code you want to download. Don’t check OWCD AND VERIFY in flash loader window. Push start button in flash loader window.
  • Page 100 6. DOWNLOAD AND CALIBRATION 3. Download method when battery under 3.2 voltage First : Remove battery in the phone Second : Connect TA to the Datakit Third : Connect phone to the Datakit. Figure 6-2. Download Setup 2. - 101 -...

  • Page 101: Calibration

    6. DOWNLOAD AND CALIBRATION 6.2 Calibration A. Equipment List Table 6-1. Calibration Equipment List. Type / Model Brand Equipment for Calibration Wireless Communication Test Set HP 8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply Service SW Laputa Test SIM card PC (For Software Installation) Pentium II Class above 300MHz...
  • Page 102 6. DOWNLOAD AND CALIBRATION JTAG2 JTAG1 AUDIO Status REMOTE POWER UART Status POWER DC IN Figure 6-3 The top view of Test JIG C. Test Jig Operation Power Source Description Power Supply Usually 4.0V DC Adaptor 9.5V, 500mA Table 6-2 Jig Power Switch Number Name Description...
  • Page 103 6. DOWNLOAD AND CALIBRATION 1. Connect as Fig. 9-3.(RS232 Serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0 V, also DC adaptor may be used DIP SW 3.

  • Page 104: Block Diagram

    7. BLOCK DIAGRAM - 105 -...

  • Page 105: Circuit Diagram

    S_VSS1 F_WE MODEL G1500 07/30 F_CE _ROMCS Designer YS JIN F_VCC1 2003 S_VCC1 C162 F_VCCQ Checked 0.1u DRAWING MAIN NAME Approved NC10 DRAWING NC11 Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 107 -...

  • Page 106: Memory & Mmi

    G1500 2.2u 07/30 Designer YS JIN 2003 R249 KEY_BACKLIGHT 1.5K Checked DRAWING MEMORY & MMI R252 Q203 NAME VIBRATOR 2SC5585 Approved Q201 IMX9T110 DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 108 -...

  • Page 107: Midi

    C314 R312 VOUTNORN C315 Section Date Sign & Name Sheet/ Sheets MODEL G1500 07/30 Designer YS JIN 2003 Checked DRAWING MIDI NAME Approved DRAWING Iss. Notice No. Date Name V1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 109 -...

  • Page 108: Rf Circuit

    Designer YS JIN 2003 U414 Checked VSYNTHEN DRAWING TEMPSENSE _ERR RF Circuit C460 R431 NAME C461 2.2u Approved ADP3330 2012 2012 C462 470p DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc - 110 -...

  • Page 109: Pcb Layout

    9. PCB LAYOUT - 111 -...
  • Page 110 9. PCB LAYOUT - 112 -...

  • Page 111: Standalone Test

    10. STAN ALONE TEST 10. STANDALONE TEST 10.1 What’s the Standalone Test? Set the Phone to Perform only Tx or Rx mode. 1. During the Normal Call 2. During Rx Standalone 3. During Tx Standalone - 113 -...

  • Page 112: Standalone Test Equipment Setup

    10. STAN ALONE TEST 10.2 Standalone Test Equipment Setup GSM Test Equipment Power Supply RS-232 Cable Phone - 114 -...

  • Page 113: H/W Test

    10. STAN ALONE TEST 10.3 HW Test : Software for Standalone Test Setup Rx Standalone Test setting Block Tx Standalone Test setting Block Connect, Test Start Signal Flow window - 115 -...
  • Page 114 10. STAN ALONE TEST 10.4 Tx Stand alone Test Setting 1. Setting the Test Equipment as ‘Test Mode-BCH’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : BCH For HP8922 Operating mode : Test Mode 2.
  • Page 115 10. STAN ALONE TEST Tx Stand alone Test Setting 3. Select ‘Tx’ 4. Select ARFCN For GSM : 62CH For DCS : 700CH 5. Select Tx Power Level For GSM : 5 For DCS : 0 7. Press ‘Start’ 6. Press ‘Connect’ - 117 -...

  • Page 116: Rx Stand Alone Test Setting

    10. STAN ALONE TEST 10.5 Rx Stand alone Test Setting 1. Setting the Test Equipment as ‘CW Mode’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : CW For HP8922 Operating mode : CW Generator 2.
  • Page 117 10. STAN ALONE TEST Rx Stand alone Test Setting 3. Select ‘Rx’ 4. Select Gain Control Index ’17’ for Both Band 5. Press ‘Connect’ 6. Press ‘Start’ - 119 -...

  • Page 118: What's The Rx Calibration

    10. STAN ALONE TEST 10.6 What’s the Rx Calibration Setting the AGC Gain to make same Rx Power fed into the Base Band Part Regardless of Antenna Input Level Part X(Input Level)+G(Gain)=Y 10.7 What’s the Tx Calibration To make Tx Power Level transmitted properly following the information of Base Station Example) GSM 6 Level Mobile...

  • Page 119: How To Rx Calibration

    10. STAN ALONE TEST 10.8 How to Rx Calibration 1. Setting And Test same as Rx Standalone Test 2. Read the Gain Value on the HWTest Software 3. Using the calculation Excel File, Calculate Rx Gain Table Value 4. Using Caledit Software, Open the Basic.bin 5.
  • Page 120 10. STAN ALONE TEST Connection→port setting BB→Configuration→Battery : port select & baud rate (38400) : power(3.8) & count(10) EGSM : -0.3 DCS : -0.5 - 122 -...
  • Page 121 10. STAN ALONE TEST 3. RF→Configuration→AGC Check “index17” Check “index17” - 123 -...
  • Page 122 10. STAN ALONE TEST 3. RF→Configuration→AGC - 124 -...
  • Page 123 10. STAN ALONE TEST HP6632B→Disable GSM: -0.3 Click ‘RUN’ button DCS: -0.5 - 125 -...

  • Page 124: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 Exploded View Battery SBPL0072113 Screw_Taptite GTZZ0000604 18 Cap_MobileSwitch MCCF0012001 Locker_BAT MLEA0012901 Spring_Locker MSDB0001701 Cover_Rear MCJN0016701 Cap_EarJack MCCC0011601 SJMY0006102 Vibrator_Motor Antenna SNGF0003101 Speaker SUSY0007801 LCD Module SVLM0003801 PCB Ass’y SAFY0086101 Dome Ass’y ADCA0015501 BTN Ass’y ABGA0002301 Microphone...

  • Page 125: Accessory

    Description Part Number Specification Color Remark MHBY00 HANDSTRAP MHBY0001101 Neck Strap 400mm (CDMA,common use) Gray 3.7 V,850 mAh,1 CELL,PRISMATIC ,G1500 SBPL00 BATTERY PACK,LI-ION SBPL0072113 Silver BATTERY(SV) SGEY00 EAR PHONE/EAR MIKE SET SGEY0002901 G7000,G5200 Common use, 3P EAR MIC 100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST ,EU...

  • Page 126: Replacement Parts

    G1500 pad (9.3 * 9.3, t=3.0) Black Pearl MSDB00 SPRING,COIL MSDB0001701 G7000 White MTAB00 TAPE,PROTECTION MTAB0032701 G1500 Rear protect tape 3 V,.9 A,12*18 ,G1500 PORON 0.5MM, CONNECTOR SJMY00 VIBRATOR,MOTOR SJMY0006102 TYPE ADCA00 DOME ASSY,METAL ADCA0015501 G1500 EUASV, SILVER Silver AWAB00 WINDOW ASSY,LCD...
  • Page 127 Level Location No. Description Part Number Specification Color Remark 128*64 ,34.8*30.55*4.4(t) ,D/IC:S6B0723TB- LCD MODULE SVLM0003801 01(SSE),LED B/L(BLUE) MCCF00 CAP,MOBILE SWITCH MCCF0012001 G1500 EUASV, SILVER Silver MICROPHONE SUMY0004601 ASSY ,-40 dB,6*1.5 ,W3000 MIC MLAK00 LABEL,MODEL MLAK0006901 MTAB TAPE,PROTECTION MTAB0028801 Cobalt MLAZ00...

  • Page 128: Replacement Parts

    <Main component> Level Location No. Description Part Number Specification Color Remark SAFY00 PCB ASSY,MAIN SAFY0086001 G1500 BAR TYPE B/W LCD Silver SAFA00 PCB ASSY,MAIN,AUTO SAFA0031601 G1500 BAR TYPE B/W LCD Silver CONN,JACK/PLUG, BAT101 ENJE0003001 2 ,2 PIN,W3000 Back Up Battery Holder...
  • Page 129 Level Location No. Description Part Number Specification Color Remark C134 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C135 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C136 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C137 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C138 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C139 CAP,CERAMIC,CHIP ECCH0000371 0.22 uF,50V,Z,Y5V,HD,2012,R/TP C140 CAP,CERAMIC,CHIP ECCH0000379 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP...
  • Page 130 Level Location No. Description Part Number Specification Color Remark C223 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C224 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C225 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C226 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C227 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C228 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C229 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 131 Level Location No. Description Part Number Specification Color Remark C416 CAP,TANTAL,CHIP ECTH0001701 10 uF,6.3V ,M ,L_ESR ,2012 ,R/TP C417 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP C418 CAP,CERAMIC,CHIP ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP C419 CAP,CERAMIC,CHIP ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP C420 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C421 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C422...
  • Page 132 Level Location No. Description Part Number Specification Color Remark C466 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C469 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C470 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP 24 PIN,0.5 mm,ANGLE ,SN-PB ,FPCB 0.2T / HEIGHT CN304 CONNECTOR,FFC/FPC ENQY0005301 CN401 CONN,RF SWITCH ENWY0000401 STRAIGHT ,SMD ,0.1 dB,3*3*1.8 / 500 CYCLES CN402 CONN,RECEPTACLE ENEY0002501...
  • Page 133 Level Location No. Description Part Number Specification Color Remark Q203 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY Q204 TR,BJT,NPN EQBN0004801 SMT6 ,0.2 W,R/TP , R101 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R102 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R103 RES,CHIP ERHY0000248 2.4K ohm,1/16W,J,1005,R/TP R104 RES,CHIP ERHY0001103 0.33 ohm,1/4W ,F ,2012 ,R/TP...
  • Page 134 Level Location No. Description Part Number Specification Color Remark R212 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R213 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R214 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R223 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP R224 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R225 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R226 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP...
  • Page 135 Level Location No. Description Part Number Specification Color Remark R315 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP R316 RES,CHIP ERHY0000246 2K ohm,1/16W,J,1005,R/TP R401 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP R402 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R403 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R404 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R405 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP...
  • Page 136 Level Location No. Description Part Number Specification Color Remark 68-BALL STACKED-CSP ,68 PIN,R/TP ,14 X 8 U106 EUSY0101502 MATRIX / 32-FLASH / 08-SRAM / 70 NS U201 EUSY0077301 SC70-6/SOT23-6 ,6 PIN,R/TP , U302 EUSY0077701 SC70-5 ,5 PIN,R/TP , 10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOG U303 EUSY0119001 SWITCHES...

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