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HP Z2 Tower G5 Product End-Of-Life Disassembly Instructions

HP Z2 Tower G5 Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Workstation
Marketing Name / Model
[List multiple models if applicable.]
HP Z2 Tower G5 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries, excluding Li-Ion batteries.
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
With a surface greater than 10 sq cm
All types including standard alkaline, coin or button style
batteries
Battery(ies) are attached to the product by (check all
that apply with an "x" inside the "[ ]"):
[
[X] snaps
[
[
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Chicony 700W EPA92 PSU
Power Cord
HPI instructions for this template are available at
HP's Sustainability
Contact.
] screws
] adhesive
] other. Explain
EL-MF877-01
Quantity of
items
included in
product
3
1
2
1
Page 1

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Summary of Contents for HP Z2 Tower G5

  • Page 1 Marketing Name / Model [List multiple models if applicable.] HP Z2 Tower G5 Workstation Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of items Item Description Notes included in product Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances...
  • Page 3 27. Remove MB from chassis 28. Use T-15 screwdriver remove the screws on the PSU Chassis 29. Disconnect the PSU cable from the MB 30. Remove the PSU from chassis 31. Use PH1 screwdriver to remove screw for the PSU 32.
  • Page 4 Step7 Remove the ODD from ODD cage Step8 Use T-15 screw driver to loose the screws of iron plate EL-MF877-00 Page 4 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 5 Step 9 Remove the iron plate of ODD Step 10 Loose the screws of HDD and remove HDD from HDD cage Step 11 Disconnect HDD power cable and HDD SATA cable Step 12 Remove the driver cage from Chassis from HDD EL-MF877-00 Page 5 Template Revision C...
  • Page 6 Step 13 Disconnect system fan cable from MB Step 14 Disconnect all cables from MB Step 15 Use PH1 screwdriver to remove system fan from Step 16 Remove system fan from chassis chassis EL-MF877-00 Page 6 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 7 Step 17 Use T-15 screwdriver to loose the screws and remove Step 18 Use PH1 screwdriver to loose the screws and remove cooler the fan Step 19 Separate the fan from cooler Step 20 Remove memory from MB EL-MF877-00 Page 7 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at...
  • Page 8 Step 21 Rotate the handle and open it up Step 22 Remove the CPU from the board Step 23 Remove the battery from the system board Step 24 Remove speaker from Chassis EL-MF877-00 Page 8 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 9 Step 25 Remove WLAN M.2 Card Step 26 Use T-15 screwdriver to loose the screws of MB from board Step 27 Remove MB from chassis Step 28 Use T-15 screwdriver remove the screws on the PSU Chassis EL-MF877-00 Page 9 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at...
  • Page 10 Step 29 Disconnect the PSU cable from the MB Step 30 Remove the PSU from chassis Step 31 Use PH1 screwdriver to remove screw for the PSU Step 32 Remove cover EL-MF877-00 Page 10 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...
  • Page 11 Step 33 Use PH1 screwdriver to remove FG screw Step 34 Disconnect fan connector and inlet connector Step 35 Use PH1 screwdriver to remove AC inlet & Fan screw Step 36 Remove the PCB from the the PSU EL-MF877-00 Page 11 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at...
  • Page 12 Step 37 Heat the solder of the Electrolytic Capacitors of Step 38 The electrolytic Capacitors had been removed. greater than 2.5cm in diameter or height and Remove it EL-MF877-00 Page 12 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01...