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LG C3100 Service Manual
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LG C3100 Service Manual

LG C3100 Service Manual

Lg c3100 mobile phone service manual
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Service Manual
C3100
P/N : MMBD0033001
Date : June, 2004 / Issue 1.0

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  • Page 1 Service Manual C3100 P/N : MMBD0033001 Date : June, 2004 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents ........1. INTRODUCTION 6. DOWNLOAD AND CALIBRATION 1.1 Purpose ..........2 6.1 Download ........... 72 1.2 Regulatory Information ......2 6.2 Calibration .......... 79 1.3 Abbreviations ........4 ......7. BLOCK DIAGRAM ........2. PERFORMANCE ......8.

  • Page 3: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of C3100. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person...
  • Page 4 1. INTRODUCTION F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. H.

  • Page 5: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Rate CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrostatic Discharge FPCB Flexible Printed Circuit Board...
  • Page 6 1. INTRODUCTION Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM STMR Side Tone Masking Rating Travel Adapter Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol - 5 -...

  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 950 mAh Standard Battery Size: 35.00 x 53.45 x 5.7mm Weight: 30.00g Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.

  • Page 8: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification TX: 890 + n x 0.2 MHz RX: 935 + n x 0.2 MHz (n=1~124) EGSM Frequency Band TX: 890 + (n-1024) x 0.2 MHz RX: 935 + (n-1024) x 0.2 MHz (n=975~1024) TX: 1710 + (n-512) x 0.2 MHz RX: 1805 + (n-512) x 0.2 MHz (n=512~885) RMS <...
  • Page 9 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 –30 –33 –60 600~ <1,200 –60 1,200~ <1,800 –60 1,800~ <3,000 –63 3,000~ <6,000 –65 Output RF Spectrum 6,000 –71 (due to modulation) Offset from Carrier (kHz). Max.
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM BER (Class II) < 2.439% @–102 dBm Bit Error Rate BER (Class II) < 2.439% @–100 dBm RX Level Report Accuracy 3 dB 8 3 dB Frequency (Hz) Max.(dB) Min.(dB) –12 – – –12 Sending Response 1,000...
  • Page 11 2. PERFORMANCE Item Description Specification At least 80 dB under below conditions: Ringer Volume 1. Ringer set as ringer. 2. Test distance set as 50 cm. CC Charge : < 500 mA Charge Current Trickle Charge : < 60 mA Antenna Bar Number Power –85 dBm ~...

  • Page 12: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4205, U401) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular handsets and wireless data modems.
  • Page 13 3. TECHNICAL BRIEF (1) Receiver part The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional superheterodyne architectures. A.
  • Page 14 3. TECHNICAL BRIEF Figure 3-2. Block Diagram of Receiver part of SI4205 B. Intermediate frequency (IF) and Demodulation A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes.
  • Page 15 3. TECHNICAL BRIEF (2) Transmitter part The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
  • Page 16 3. TECHNICAL BRIEF (3) Frequency Synthesizer Figure 3-4. Block Diagram of Frequency Synthesizer part of SI4205 The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs.

  • Page 17: Power Amplifier Module (Rf3133, U400)

    3. TECHNICAL BRIEF 3.2 Power Amplifier Module (RF3133, U400) The RF3133 is a high-power, high-efficiency power amplifier module with integrated power control. The device is self-contained with 50Ω input and output terminals. The power control function is also incorporated, eliminating the need for directional couplers, detector diodes, power control ASICs and other power control circuitry;...

  • Page 18: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.3 13 MHz Clock The 13 MHz clock (X400) consists of a TCXO (Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band chipset (U101, AD6521), digital base band chipset (U102, AD6525), and MIDI (U200) chipset. 2V75_VTCXO X400 R414...

  • Page 19: Digital Main Processor (Ad6525, U100)

    3. TECHNICAL BRIEF 3.5 Digital Main Processor (AD6525, U100) (1) Architecture Overview AD6525 Serial Link AD6525 Subsystem (VBC) DSP BUS EBUS PBUS DMA and BUS RBUS ARBITRARION SBUS Peripheral SRAM FLASH Subsystem Subsystem ® (ARM7TDMI RF-Control Figure 3-8. Block Diagram of the AD6525 Internal Architecture The internal architecture of AD6525 is shown in Figure 3-8.
  • Page 20 3. TECHNICAL BRIEF The microcontroller subsystem supports all the GSM terminal software, including the layer 1, 2 and 3 of the GSM protocol stack, the MMI, and applications software such as data services, test and maintenance. It is tightly associated with on-chip system SRAM and also includes boot ROM memory with a small dedicated routine to facilitate the initialization of the external Flash Memory via code download using the on-chip serial interface to the external Flash Memory interface.
  • Page 21 3. TECHNICAL BRIEF AD6522 GSM-PROCESSOR JTAGEN KEYPADCOL[4:0] KEYPAD TCK, TMS KEYPADROW[4:0] JTAG Matrix TDI, TDO Backlight BACKLIGHT0 JTAGE, HSL, GPIO Universal Service light BACKLIGHT1 USCTX/RX/CLK System Generic Serial port A Connector Generic Serial port B (USC) Generic Serial port D ROMCS FLASH ADD[23:0]...
  • Page 22 3. TECHNICAL BRIEF (2) Interconnection with external devices A. RTC Block Interface Countered by external crystal oscillator (MC-146, X100). The X-tal oscillates 32.768 KHz. B. LCD Module Interface Controlled by LCD_CS, LCD_RES, ADD1, WR, DATA[0:15], LCD_DIM, and LCD_ID. Table 3-3. LCD module interface Description LCD_CS LCD driver chip enable.
  • Page 23 3. TECHNICAL BRIEF D. SIM Interface The AD6525 check status periodically in call mode if SIM card is inserted or not, but the AD6525 dosen't check in deep sleep mode. Interface signals are SIM_DATAOP, SIM_CLK, SIM_RST, SIM_EN. Table 3-5. SIM interface Description This pin receives and sends data to SIM card.

  • Page 24: Analog Main Processor (Ad6521, U101)

    3. TECHNICAL BRIEF 3.6 Analog Main Processor (AD6521, U101) (1) Block Diagram TDI TDO TNS TCK AVDD DVDD AGND DGND MCLK MCLKEN JTAG INTERFACE RESET ITXP I TRANSMIT ALTER ITXN BSDI GMSK QTXP BSIFS Q TRANSMIT ALTER QTXN TXCN 32X10 BIT 10-BIT RAMP RAM BASEBAND...
  • Page 25 3. TECHNICAL BRIEF (2) BB Transmit Section This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in accordance with GSM 05.05 Phase 2 specifications. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter.
  • Page 26 3. TECHNICAL BRIEF R104 100K C106 C107 C123 TXIP TXIN TXQN TXQP RXIP RXIN RXQP RXQN TX_RAMP BOARD_TEMP R108 TEMPSENSE TP119 C108 C110 C111 C113 C112 C109 AUXADC4 0.1u (1608) CLOSE TO AD6521 AUXIP AUXIN 0.1u C150 VINNORP C115 C116 C117 C118 VINNORN...

  • Page 27: Power Management Ic (Adp3522, U301)

    3. TECHNICAL BRIEF 3.7 Power Management IC (ADP3522, U301) Block Diagram VBAT VRTCIN VBAT2 SIMSEL SIM LDO ADP3522 VSEL VBAT VSIM DEEP VREF DISCHARGED 110kΩ DGND UVLO UVLO PWRONKEY DIGITAL CORE LDO OVER TEMP ROWX VBAT SHUTDOWN VCORE VREF PWRONIN DGND ANALOG LDO VBAT...
  • Page 28 3. TECHNICAL BRIEF Power on sequence If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. REFOUT is also enabled, Reset signal is generated and send to the AD6525. LDO block There are 6 LDOs in the ADP3522.

  • Page 29: Memory (U300)

    3. TECHNICAL BRIEF 3.8 Memory (U300) The memory is consists of 128Mbit Nor Flash Memory and 32Mbit Pseudo SRAM. It has 16 bit parallel data bus and 22 bit address. Software, RF calibration data, audio parameters and battery calibration data are stored in the Flash memory.

  • Page 30: Lcd And Lcd Backlight

    3. TECHNICAL BRIEF 3.9 LCD and LCD Backlight (1) LCD Features Display Mode : Transmissive 65K Color STN LCD Color Depth : 32 (Red) * 64 (Green) * 32 (Blue) = 65K Color Resolution : 128 * RGB * 128 dots for Color display Interface : 80-series MPU interface Data bus : 16 bit Parallel interface Duty ratio : 1/96 Duty for Color display...

  • Page 31: Keypad Switches And Key Backlight Illumination

    3. TECHNICAL BRIEF 3.10 Keypad Switches and Key Backlight Illumination (1) Keypad Switches The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 21 switches (KB500-KB522), connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power switch (KB500), which is connected independently.

  • Page 32: Microphone

    3. TECHNICAL BRIEF (2) Key Backlight Illumination There are 6 blue LEDs for key backlight illumination which are driven by KEY_BACKLIGHT signal from AD6525. KEY BACKLIGHT C319 C320 C321 C322 C323 C324 U302 MAX4599EXT-T R312 NO 6 KEY_BACKLIGHT C318 0.1u R316 RPWRON Figure 3-16.

  • Page 33: Dual Mode Speaker And Midi Ic

    3. TECHNICAL BRIEF 3.12 Dual Mode Speaker and MIDI IC (1) Dual Mode Speaker There is a control signal (SPK_RCV_EN) which is for enabling receiver or speaker because one dual mode speaker is used for both receiver and speaker. The signal is produced by AD6525 and controls the analog switch (U201).
  • Page 34 3. TECHNICAL BRIEF (2) MIDI IC (YMU759B, U200) The phone uses melody IC which makes the robust joyful melody sounds. 6 signals (MIDI_RST, ADD0, RD, MIDI_CS, WR, MIDI_INT) from AD6525 are used to control the melody IC. Melody data (DATA[8:15]) is transferred to melody IC and played by the dual mode speaker. External 3.3V LDO (U202) is used for the MIDI chip because the maximum output current of analog amplifier in melody IC is 300mA.

  • Page 35: Headset Jack Interface

    3. TECHNICAL BRIEF 3.13 Headset Jack Interface 3-pole type ear-mic jack which has three electrodes such as Receiver+, Mic+, and GND. This type usually supports only single-ended configuration (VOUTAUXP for headset speaker and VINAUXP for headset mic) in the audio path. There are two control signals for jack interface.

  • Page 36: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Components SW 400 FL400 FL401 FL402 U402 U401 U400 X400 Figure 4-1. Table 4-1. Reference Description Reference Description SW400 Mobile Switch U400 Power Amplifier Module FL400 Antenna Switch U401 Transceiver FL401 Saw Filter for GSM U402 FL402 Saw Filter for DCS...

  • Page 37: Rx Trouble

    4. TROUBLE SHOOTING 4.2 RX Trouble START 62 CH, 7 level setting (TCH) 62 CH, - 60dBm setting ( BCCH) HP8922 : Test mode Spectrum ana lyzer set ting Oscilloscope setting 1. Check Regulator Circuit 2. Check VCTCXO Circuit 3. Check Control Signal 4.

  • Page 38: Checking Regulator Circuit

    4. TROUBLE SHOOTING 4.2.1 Checking Regulator Circuit U402.3 U402.3 Figure 4-3. Check Pin 3. Check Pin 5. Changing the Board RF 2.85V O.K? Pin3. High ? Regulator Circuit is OK. Replace U402. See next Page to check VCTCXO. VBAT MIC5255-2.85BM5 U402 R418 CLKON...

  • Page 39: Checking Vctcxo Circuit

    4. TROUBLE SHOOTING 4.2.2 Checking VCTCXO Circuit Figure 4-4. X400.3 X400.4 VCTCXO Circuit is OK. Check Pin 3. 13 MHz O.K? See next Page to check Refer to Graph 4-2 ANT SW & Mobile SW. Check Pin 4. Changing X400 2.75V OK? Refer to Graph 4-3 Check U301, PMIC...

  • Page 40: Checking Pll Control Signal

    4. TROUBLE SHOOTING 4.2.3 Checking PLL Control Signal S_DATA (TP404) S_CLK (TP403) S_EN (TP402) PDNB (TP401) Figure 4-5. Download the SW Check TP 401. Level is High? Check TP 402, 403, 404. Check if there is Download the SW Similar? Any Major Difference Refer to Graph 4-5 Control Signal i s OK...
  • Page 41 4. TROUBLE SHOOTING 4.2.4 Checking Antenna Switch & Mobile Switch SW400.ANT SW400 KMS-507 SW400.RF C410 SHS-C090DR FL400 GND1 FL400.10 GND2 EGSM_TX GND3 DCS_TX FL400.1 GND4 GND5 GND6 EGSM_RX GND7 DCS_RX L405 (VC1) L404 (VC2) ANT_SW2 C430 C431 ANT_SW1 Figure 4-6. C433 C434 3.3p...

  • Page 42: Checking Saw Filter

    4. TROUBLE SHOOTING 4.2.5 Checking SAW Filter C420 C422 L402 FL401 27nH EFCH942MTCA7 C423 C425 L403 FL402 7.5nH EFCH1842TCA7 C428 FL401 FL402 Figure 4-7. Check RF Level of Changing Saw Filter Input FL401.1 : ~ -61dBm C422 for GSM For GSM : FL401.1 Check the parts are well Soldered For GSM : C422...

  • Page 43: Checking Rx Iq

    4. TROUBLE SHOOTING 4.2.6 Checking RX IQ C417, C419 C417 C419 Figure 4-8. Check C417, C419. Check if there is Similar? Replace U401 Any Major Difference • Refer to Graph 4-6 Redownload the Software And calibrate Graph 4-6 - 42 -...

  • Page 44: Tx Trouble

    4. TROUBLE SHOOTING 4.3 TX Trouble START HP8922 :Test mode 62 CH,7 level setting (TCH) 62 CH,-60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting 1. Check Regulator Circuit 2. Check VCTCXO Circuit 3. Check Control Signals 4. Check TX IQ 5.
  • Page 45 4. TROUBLE SHOOTING 4.3.1 Checking Regulator Circuit U402.3 U402.3 Figure 4-10 Check Pin 3. Check Pin 5. RF 2.85V O.K? Pin3. High ? Changing the Board Regulator Circuit is OK. Replace U402 See next Page to check VCTCXO. VBAT MIC5255-2.85BM5 U402 R418 CLKON...
  • Page 46 4. TROUBLE SHOOTING 4.3.2 Checking VCTCXO Circuit Figure 4-11 X400.3 X400.4 VCTCXO Circuit is OK. Check Pin 3. 13 MHz O.K? See next Page to check • Refer to Graph 4-8 ANT SW &Mobile SW. 2.75V OK? Changing X400 Check Pin 4. •...
  • Page 47 4. TROUBLE SHOOTING 4.3.3 Checking PLL Control Signal S_DATA (TP404) S_CLK (TP403) S_EN (TP402) PDNB (TP401) Figure 4-12 Level is High? Download the SW Check TP 401. Check TP 402, 403, 404. Check if there is Download the SW Similar? Any Major Difference •...

  • Page 48: Checking Tx Iq

    4. TROUBLE SHOOTING 4.3.4 Checking TX IQ C421, C424 C421 C424 Figure 4-13 Check C421, C424. Check if there is Replace U401 Similar? Any Major Difference • Refer to Graph 4-12 Redownload the Software And calibrate Graph 4-12 - 47 -...

  • Page 49: Checking Pam Control Signal

    4. TROUBLE SHOOTING 4.3.5 Checking PAM Control Signal TX_RAMP (R401 ) PA_EN (R402) Figure 4-14 VBAT R401 TX_RAMP AD6521 R402 PA_EN GPO_16 C401 C402 C403 R404 PA_BAND GPO_17 C405 C406 C407 GSM_IN VCC1 VRAMP GSM_OUT VREG RF3133 VCC_OUT VBATT U400 TX_ENABLE DCS_OUT BAND_SELECT...
  • Page 50 4. TROUBLE SHOOTING 4.3.6 Checking Antenna Switch & Mobile Switch SW400.ANT SW400 KMS-507 SW400.RF FL400.5 C410 FL400.3 SHS-C090DR FL400 GND1 L405 (VC1) GND2 EGSM_TX GND3 DCS_TX GND4 L404 (VC2) GND5 GND6 EGSM_RX GND7 DCS_RX Figure 4-15 ANT_SW2 C430 C431 ANT_SW1 For the test, C433 C434...
  • Page 51 4. TROUBLE SHOOTING (VCX) (VC2) Graph 4-14 DCS TX (VCX) (VC2) Graph 4-15 EGSM TX - 50 -...

  • Page 52: Power On Trouble

    4. TROUBLE SHOOTING 4.4 Power On Trouble SETTING : Connect PIF, and set remote switch off at PIF. • Refer to Figure 4-16. START Check Battery Voltage Charge or Change Battery >3.35V ? Push power-on key Check the contact of power-key and check the level change or dome switch.
  • Page 53 4. TROUBLE SHOOTING U301.21 U301.20m 1V8_VCORE 2V8_VMEM U301.25 2V75_VTCXO U301.29 RPWRON U301.30 POWERKEY Figure 4-16 U301.3 2V0_VRTC PMIC C300 C301 0.1u (1608) U301 ADP3522XCP-3 POWERKEY _PWRONKEY 31 ROWX KEYROW0 VSIM RPWRON PWRONIN VCORE C302 CLKON TCXOEN (2012) SIM_EN SIMEN RESCAP SIMVSEL VTCXO GATEDR...

  • Page 54: Charging Trouble

    4. TROUBLE SHOOTING 4.5 Charging Trouble SETTING : Connect the battery (3.4 ~4V) and the charging adaptor (TA)to the START Charging Connector(CN601) Re-solder CN601. well-soldered? The charging adaptor (TA) is out of order. Voltage at Pin 7 of U301 Change the charging adaptor. =5.2V? R300, Q300, D300 Re-solder R300, Q300, D300.
  • Page 55 4. TROUBLE SHOOTING Q300 R300 D300 Figure 4-17 Charging current direction C302 (2012) CUS02 D300 TPCF8102 Q300 - 54 -...

  • Page 56: Lcd Trouble

    4. TROUBLE SHOOTING 4.6 LCD Trouble CN600 Figure 4-18 U600.9 U600 (LCD_DIM) Figure 4-19 START PIF Power On Is the connection of LCD Reassemble LCD module with module with LCD connector on LCD connector PCB OK? Not OK Check the soldering Re-solder CN600 Of CN600 Check pin9 of U600 is...

  • Page 57: Receiver Trouble

    4. TROUBLE SHOOTING 4.7 Receiver Trouble R206 U201 NLAS4684MR2 COM2 COM1 R206 RCVP C207 U201 CN200 R207 RCVN C210 C211 C212 SPK_RCV_EN R207 R209 Figure 4-20. START Check the signal level of Replace the Main board. Check the soldering RCVP &RCVN at R206,R207.Are ABB is out of order.

  • Page 58: Speaker Trouble

    4. TROUBLE SHOOTING 4.8 Speaker Trouble SETTING : Connect PIF to the phone, and Power on. Enter The engineering mode, and set “Melody on” at Buzzer of BB test menu. START Replace U202 Voltage across C235 Check the soldering of (Melody IC LDO) =3.3 V? U202...
  • Page 59 4. TROUBLE SHOOTING C238 U202 U200 C235 R236 U201 R234 R209 Figure 4-21. U200 YMU759B R230 HPOUT_R 13MHZ CLK1 MIDI_RST _RST HPOUT_L 2V8_VMEM ADD0 R231 MIDI_CS R232 IFSEL C232 390p MIDI_INT _IRQ C200 DATA8 EXT1 DATA9 EXT2 DATA10 DATA11 DATA12 R234 DATA13 SPOUT1...

  • Page 60: Mic Trouble

    4. TROUBLE SHOOTING 4.9 MIC Trouble R211 C217 R214 C250 MIC200 C221 C222 Figure 4-22. Figure 4-23. C216 C250 C217 (1608) R211 R240 MIC200 VINNORP C219 R214 OB4-15L42-C33L VINNORN START Voltage at pin 23 of Replace the Check the C217 voltage is U301 is 2.55V(DC)? U301.

  • Page 61: Vibrator Trouble

    4. TROUBLE SHOOTING 4.10 Vibrator Trouble SETTING : After initialize Agilent 8960, Test in EGSM, connect PIF to the phone, and Power on. Enter The engineering mode, and set “Vibrator on” at Vibration of BB test menu START Check the soldering of Is the voltage at pin 3 of Re-solder R501 Q500 near 0V?
  • Page 62 4. TROUBLE SHOOTING CN500 R500 CN500 Q500 Figure 4-24. VBAT CN500 C504 R501 VIBRATOR 1.5K - 61 -...

  • Page 63: Key Backlight Led Trouble

    4. TROUBLE SHOOTING 4.11 Key Backlight LED Trouble SETTING : After initialize Agilent 8960, Test in EGSM, connect PIF to the phone, and Power on. Enter The engineering mode, and set “Vibrator on” at Vibration of BB test menu START PIF Power On Check the soldering of Is the voltage level at Pin1 at...

  • Page 64: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.12 SIM Detect Trouble Setting : Insert the SIM into J301. Connect PIF to the phone, and power on. START Does the SIM Change the SIM.Our phone supports 3V SIM only. supports 3V? Voltage at pin 18 of Voltage at pin 1 of Replace U301.

  • Page 65: Ear Jack Trouble

    4. TROUBLE SHOOTING 4.13 Ear Jack Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode. START Inset the earphone to the phone Does the audio profile of Check the Check the Replace voltage at pin1 of thephone change to the soldering U204 soldering J200 U204...
  • Page 66 4. TROUBLE SHOOTING U204.1 U204 J200 U203 Figure 4-28. C224 C228 C227 Figure 4-30. Figure 4-29. R213 AUXIN C225 C223 C251 C224 U203 MAX9075EXK-T VIN- HOOK_DETECT VIN+ C226 U204 MAX9075EXK-T VIN- AUXIP HEADSET_MIC_P JACK_DETECT VIN+ R220 C244 Headset jack (1608) C227 R224 HEADSET_SPK_P...

  • Page 67: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION Figure 5-1. Figure 5-2. - 66 -...
  • Page 68 5. DISASSEMBLY INSTRUCTION Figure 5-3. Figure 5-4. - 67 -...
  • Page 69 5. DISASSEMBLY INSTRUCTION Figure 5-5. - 68 -...
  • Page 70 5. DISASSEMBLY INSTRUCTION Figure 5-6. Figure 5-7. - 69 -...
  • Page 71 5. DISASSEMBLY INSTRUCTION Figure 5-8. Figure 5-9. - 70 -...
  • Page 72 5. DISASSEMBLY INSTRUCTION Figure 5-10. - 71 -...

  • Page 73: Download And Calibration

    6. DOWNLOAD AND CALIBRATION 6. DOWNLOAD AND CALIBRATION 6.1 Download A. Download Setup Figure 6-1 describes Download setup. UART Figure 6-1. Download Setup - 72 -...
  • Page 74 6. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Access Flash loader program in PC and select Erase. (Don’t check OWCD) 1. Select Erase 2. Check 3. Don’t Check OWCD 2. Press Start and Wait until Erase is completed. 1. Press Start and Wait - 73 -...
  • Page 75 6. DOWNLOAD AND CALIBRATION 3. Change Address and Size (Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again (Alchemy 8W8Cerase) 1. Change Address and Size 2. Don’t Check 3. Press Start and OWCD Wait 4.
  • Page 76 6. DOWNLOAD AND CALIBRATION 5. Choose software 1. Select File 2. Press Open 6. Wait until converting from MOT to BIF is completed (Don’t check OWCD) 2. Wait until completion 1. Don’t Check OWCD - 75 -...
  • Page 77 6. DOWNLOAD AND CALIBRATION 7. Press Start and Power on the phone using JIG remote Power on (Switch 1) 8. Wait until Sending Block is completed - 76 -...
  • Page 78 6. DOWNLOAD AND CALIBRATION 9. Press Write to start Download and press Key to choose software (CodeData.mot) 10. Choose software - 77 -...
  • Page 79 6. DOWNLOAD AND CALIBRATION 11. Wait until Sending Block is completed 1. Wait Until Sending Block is completed - 78 -...

  • Page 80: Calibration

    6. DOWNLOAD AND CALIBRATION 6.2 Calibration A. Equipment List Table 6-1. Calibration Equipment List Equipment for Calibration Type/Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIB interface card HP-GPIB Agilent Calibration &...
  • Page 81 6. DOWNLOAD AND CALIBRATION Figure 6-3. The top view of Test JIG C. Test Jig Operation Table 6-2. Calibration Equipment List Power Source Description Power Supply usually 4.0V Travel Adaptor Use TA, name is TA-20G (24pin) Table 6-3. Calibration Equipment List Switch Number Name Description...
  • Page 82 6. DOWNLOAD AND CALIBRATION 1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3 rd , 4 th of DIP SW ON state always 4.

  • Page 83: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM Power supply - 82 -...

  • Page 84: Circuit Diagram

    KEYPADCOL2 KEYCOL3 KEYPADCOL3 KEYCOL4 KEYPADCOL4 Section Date Sign & Name Sheet/ Sheets MODEL C3100 Designer GUIDE HOLE Checked DRAWING AD6525/AD6521 NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. VER 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 83 -...
  • Page 85 HEADSET_MIC_P HEADSET_MIC_P J200 C229 C243 C230 C242 Section Date Sign & Name Sheet/ Sheets MODEL C3100 Designer Checked DRAWING AUDIO/MIDI NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. VER 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 84 -...
  • Page 86 CE2PS 0.1u NC14 NC15 C316 R316 RPWRON Section Date Sign & Name Sheet/ Sheets MODEL C3100 Designer Checked DRAWING PMIC/MEMORY NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. VER 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 85 -...
  • Page 87 R419 C436 RF_EN GPO_4 Section Date Sign & Name Sheet/Sheets C438 MODEL C3100 Designer RF BOARD TEMPERATURE Checked DRAWING RF(AERO1) NAME Approved DRAWING Iss. Notice No. Date Name VER 1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 86 -...
  • Page 88 R501 R514 KEYCOL3 VIBRATOR 1.5K R515 KEYCOL4 Section Date Sign & Name Sheet/ Sheets MODEL C3100 Designer Checked DRAWING SIM/KEYPAD/VIBRATOR NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. VER 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 87 -...
  • Page 89 R642 USC5 CN602 TEMPSENSE C630 C626 C628 C627 Section Date Sign & Name Sheet/ Sheets MODEL C3100 Designer Checked DRAWING IO/SIM NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. VER 1.0 LG Electronics Inc. - 88 -...

  • Page 90: Pcb Layout

    9. PCB LAYOUT 9. PCB LAYOUT - 89 -...
  • Page 91 9. PCB LAYOUT - 90 -...

  • Page 92: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
  • Page 93 10. ENGINEERING MODE F. BATTERY [1-6] • Bat Cal [1-6-1] : This displays the value of Battery Calibration. The following menus are displayed in order; BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT • TEMP Cal [1-6-2] : This displays the value of Temperature Calibration. The following menus are displayed in order;...

  • Page 94: Rf Test [Menu 2]

    10. ENGINEERING MODE 10.2 RF Test [MENU 2] Radio Frequency Test A. SAR Test [2-1] This menu is to test the Specific Absorption Rate. • SAR Test On [2-1-1] : Phone continuously process TX only. Call-setup equipment is not required. •...

  • Page 95: Trace Option [Menu 4]

    10. ENGINEERING MODE 10.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 10.5 Call Timer [MENU 5] A. All calls [5-1] This displays total conversation time. User cannot reset this value. B.

  • Page 96: Stand Alone Test

    11. STAND ALONE TEST 11. STAND ALONE TEST 11.1 What’s the Standalone Test? Set the Phone to Perform only Tx or Rx mode for monitoring performance of Tx part or Rx part only. 1. Normal Call 2. Standalone • During Rx Standalone •...

  • Page 97: Standalone Test Equipment Setup

    11. STAND ALONE TEST 11.2 Standalone Test Equipment Setup GSM Test Equipment Power Supply RS-232 Cable Phone - 96 -...

  • Page 98: Hw Test : Software For Standalone Test Setup

    11. STAND ALONE TEST 11.3 HW Test : Software for Standalone Test Setup - 97 -...

  • Page 99: Tx Stand Alone Test Setting

    11. STAND ALONE TEST 11.4 Tx Stand alone Test Setting 1. Setting the Test Equipment as ‘Test Mode-BCH’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : BCH For HP8922 Operating mode : Test Mode 2.
  • Page 100 11. STAND ALONE TEST Tx Stand alone Test Setting - 99 -...

  • Page 101: Rx Stand Alone Test Setting

    11. STAND ALONE TEST 11.5 Rx Stand alone Test Setting 1. Setting the Test Equipment as ‘CW Mode’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : CW For HP8922 Operating mode : CW Generator 2.
  • Page 102 11. STAND ALONE TEST Rx Stand alone Test Setting - 101 -...

  • Page 103: Auto Calibration

    12. AUTO CALIBRATION 12. AUTO CALIBRATION 12.1 Overview AutoCal (Auto Calibration) is the PC side calibration tool that performs Rx and Tx calibration with Agilent 8960 or other equipment. AutoCal generates calibration data by communicating with phone and measuring equipment and writes it into calibration data block of flash memory in GSM phone.

  • Page 104: Equipment Setup

    12. AUTO CALIBRATION 12.3 Equipment Setup Figure 12-1. Equipment Setup - 103 -...

  • Page 105: Agc For Rx

    12. AUTO CALIBRATION 12.4 AGC for RX Setting the AGC Gain to make same Rx Power fed into the Base Band Part Regardless of Antenna Input Level. Part X (Input Level)+G (Gain)=Y 12.5 APC for TX To make Tx Power Level transmitted properly following the information of Base Station Example) GSM Power Level 6 Mobile...

  • Page 106: Adc

    12. AUTO CALIBRATION 12.6 ADC This procedure is for battery calibration. You can get mainBatteryConfigTable and temperatureConfigTable. 12.7 How to do calibration A. Connect cable between phone and serial port of PC. B. Connect Agilent 8960 equipment, programmable power supply, and phone. C.
  • Page 107 12. AUTO CALIBRATION - 106 -...

  • Page 108: Exploded View & Replacement Part List

    13. EXPLODED VIEW & REPLACEMENT PART LIST 13. EXPLODED VIEW & REPLACEMENT PART LIST 13.1 Exploded View - 107 -...
  • Page 109 13. EXPLODED VIEW & REPLACEMENT PART LIST - 108 -...

  • Page 110: Replacement Parts

    PALLET MPCY0008902 PALLET(New_package_pallet+aluminum euro) Silver MPCY01 PALLET MPCY0008901 PALLET(New_package_pallet+aluminum) Silver MANUAL ASSY, AMBA00 AMBA0033305 C3100 User manual assay for SFR OPERATION MCDF00 CARD,WARRANTY MCDF0003201 LG-510W France (Orange) Warranty card MMBB MANUAL,OPERATION MMBB0118005 C3100 User manual for SFR APEY00 PHONE APEY0127106...

  • Page 111: Main Pcb

    13. EXPLODED VIEW & REPLACEMENT PART LIST < Main PCB > Level Location No. Description Part Number Specification Color Remark SAFY00 PCB ASSY,MAIN SAFY0097001 C3100 BAR 900/1800MHz Silver MLAB00 LABEL,A/S MLAB0000601 HUMIDITY STICKER MLAC00 LABEL,BARCODE MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN (hardware)) SAFA00 PCB ASSY,MAIN,AUTO...
  • Page 112 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark C228 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C229 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C230 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C231 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C232 CAP,CERAMIC,CHIP ECCH0000138...
  • Page 113 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark C410 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C411 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C413 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C414 CAP,CERAMIC,CHIP ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP C415 CAP,CERAMIC,CHIP ECCH0000110...
  • Page 114 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark C618 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C619 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C620 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C621 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C622 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C623 CAP,CERAMIC,CHIP ECCH0000117...
  • Page 115 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark L400 INDUCTOR,CHIP ELCH0001406 4.7 nH,S,1005,R/TP L401 INDUCTOR,CHIP ELCH0001003 6.8 nH,J,1005,R/TP L402 INDUCTOR,CHIP ELCH0002715 27 nH,G ,1608 ,R/TP ,coil inductor L403 INDUCTOR,CHIP ELCH0002714 7.5 nH,G ,1608 ,R/TP ,coil inductor L404 INDUCTOR,CHIP ELCH0005006...
  • Page 116 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark R226 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R227 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP R229 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R230 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R231 RES,CHIP ERHY0000138 33K ohm,1/16W,F,1005,R/TP R232 RES,CHIP ERHY0000261...
  • Page 117 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark R420 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R500 RES,CHIP ERHY0000205 15 ohm,1/16W,J,1005,R/TP R501 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP R502 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R504 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP R505 RES,CHIP ERHY0000201...
  • Page 118 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark R637 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R638 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R639 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R641 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R642 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP SPFY PCB,MAIN SPFY0071301...
  • Page 119 13. EXPLODED VIEW & REPLACEMENT PART LIST < Accessory> Level Location No. Description Part Number Specification Color Remark SBPL00 BATTERY PACK,LI-ION SBPL0072126 3.7 V,950 mAh,1 CELL,PRISMATIC ,C310,T510 Silver INNERPACK BATTERY SGEY00 EAR PHONE/EAR MIKE SET SGEY0003204 L1200 ,MONO TYPE" SSAD00 ADAPTOR,AC-DC SSAD0007828 100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST ,...

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